Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor …
Applications
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Power devices
CCPAK1212 package pushes the performance of Nexperia’s power MOSFETs to the next level
by gabiNexperia announced the launch of 16 new 80 V and 100 V power MOSFETs in …
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Automotive/Transportation
Mouser Spotlights Automotive Zonal Architecture in New eBook from TE Connectivity and Microchip Technology
by gabiMouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation …
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Power devices
Navitas Showcases Breakthroughs in GaN and SiC Technologies for AI Data Centers, EVs, and Mobile Applications at CES 2025
by gabiNavitas Semiconductor, the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride …
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Power devices
Nexperia launches miniaturized leadless logic ICs to save space and enhance reliability in automotive applications
by gabiNexperia introduced a new portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. …
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Murata will introduce a selection of its next-generation technologies at CES 2025 (7th – 10th …
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Power devices
Improve the efficiency and reliability of switching power supplies: Vishay’s 1,200 V 3rd generation SiC Schottky diodes – at Rutronik
by gabiThe 3rd generation of 1,200 V SiC Schottky diodes (5 A – 40 A) with …