Technological and societal changes are forcing industrial companies around the world to make changes – …
Companies
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Manufacturing and Materials
Tresky offers a wide range of application options for ultrasonic DIE bonding
Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor …
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As the year draws to a close, Farnell Global, a fast and reliable distributor of …
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Automotive/Transportation
Mouser Spotlights Automotive Zonal Architecture in New eBook from TE Connectivity and Microchip Technology
Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation …
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Power devices
Navitas Showcases Breakthroughs in GaN and SiC Technologies for AI Data Centers, EVs, and Mobile Applications at CES 2025
Navitas Semiconductor, the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride …
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Companies
UK-headquartered optoelectronics specialist celebrates 40 years of innovation & manufacturing excellence
OMC is reflecting on 40 years of innovation and commitment to manufacturing excellence as the …
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Wurth Electronics Midcom Inc., German Branch, with EU headquarters in Munich, has opened a laboratory …
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Murata will introduce a selection of its next-generation technologies at CES 2025 (7th – 10th …
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IAR announces a revision of its long-term targets. This change reflects the company’s new growth …
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Development & add-on boards
Mouser Delivers Nordic Semiconductor nRF9151-DK Development Kit for Global LTE, Smart, and IoT Applications
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation …