Trenz Electronic, a provider of innovative FPGA and SoC-based electronic design services and solutions, has launched the TE0808 UltraSoM+ high-performance, industrial grade system-on-module delivering a host of advanced technologies packed into an extremely compact 52mm x 76mm form factor. The TE0808 UltraSoM+ delivers the advanced levels of performance demanded by next generation multi-tasking embedded systems in the automotive, broadcast, communications, industrial, medical, mil/aero, and T&M markets.
The TE0808 UltraSoM+ system-on-module integrates Xilinx’s ground-breaking Zynq® UltraScale+™ MPSoC with up to 4GB of DDR4 SDRAM main memory with 32-bit width, up to 512MB of Flash memory for configuration and operation, and assembly options to add additional volatile or non-volatile memory. Supported are Micron XTRMFlash and Spansion/Cypress HyperRAM or HyperFlash devices. Also integrated is an onboard switch-mode power delivery subsystem that includes 14 DC/DC converters and 13 LDO regulators controlled by an ultra-low power MCU to provide flexible power-saving modes. Rugged board-to-board stacking connectors provide a total of 480 terminals supporting high-speed transceiver I/O’s to the processing system and programmable logic in the FPGA part. An ultra-low jitter PLL provides all required clocks to the 20 serial transceivers.
With the Zynq UltraScale+ MPSoC as its processing engine, the TE0808 UltraSoM+ system-on-module provides design engineers with an extremely versatile, all programmable heterogeneous multiprocessing environment for the development of next-generation embedded systems. Such systems include 5G wireless, advanced driver assistance systems (ADAS), and industrial IoT applications. It delivers maximum scalability through a flexible 32/64-bit data-width processing system. The system can offload critical applications like graphics and video pipelining to dedicated processing blocks, as well as turn blocks on and off through efficient power domains and gated power islands. With a wide range of connectivity options, DSP architectural blocks, on-chip memory, and programmable logic capacity, it is the perfect fit for cost-sensitive, single platform, high-performance applications using industry-standard tools. In addition, the upcoming UltraITX+ companion baseboard enables the TE0808 UltraSoM+ to be installed in standard PC enclosures.
“The TE0808 UltraSoM+ is the first implementation of the Zynq UltraScale+ MPSoC in a system-on-module,” said Thorsten Trenz, CEO of Trenz Electronic. “In many ways, the technological advantage it delivers is so significant that it is hard to scope. It gives design engineers the technical edge they have been looking for as they grapple with the significant demands of developing the next generation of multi-tasking embedded systems.”
“The TE0808 UltraSoM+ is a truly innovative implementation of our Zynq UltraScale+ MPSoC,” said Mark Jensen, Director of Corporate Software Strategy & Marketing, Xilinx. “With Zynq UltraScale+ MPSoC technology at the heart of Trenz’s TE0808 UltraSoM+ system-on-module, designers will benefit from unparalleled flexibility, dramatically lower BOM costs, and overall project acceleration for complex embedded designs.”
Trenz Electronic
www.trenz-electronic.de