Teledyne e2v Releases Engineering Models of 16GB Space-Qualified DDR4 Memory
Teledyne e2v, a leading provider of high-reliability solutions for space applications, today announced the immediate availability of Engineering Models for its new 16GB radiation-tolerant DDR4 memory. This high-density addition expands Teledyne e2v’s space-grade DDR4 portfolio—already the most deployed in the industry—with hundreds of 4GB and 8GB flight models delivered to date.
The 16GB DDR4 device maintains the compact form factor of the existing family—just 15mm x 20mm x 1.92mm—and is pin-to-pin compatible with the 4GB and 8GB variants. This compatibility ensures a smooth upgrade path, allowing system designers to scale memory capacity without a complete board redesign.
Fully compatible with all major space-grade processors and FPGAs, including Teledyne e2v’s own LS1046-Space, LX2160-Space, and QLS1046-Space, the memory operates at speeds up to 2400MT/s. It is engineered for robustness in harsh space environments, with a Total Ionizing Dose (TID) tolerance of 100 krad (Si), Single Event Latch-up (SEL) immunity above 60 MeV.cm²/mg, and advanced SEU/SEFI mitigation for reliable, no-data-loss recovery.
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“As satellite payloads grow increasingly complex, the demand for higher memory densities becomes critical,” said Thomas Guillemain, Marketing & Business Development, Digital Processing Solutions at Teledyne e2v. “With the release of our 16GB DDR4 engineering models, system architects can begin early validation with confidence, preparing for a seamless transition to flight-qualified versions.”
Engineering Models of the 16GB DDR4 are available now, enabling early-stage development and system validation ahead of full flight deployment. Teledyne e2v supports the integration process with extensive documentation, including the latest 16GB DDR4 radiation report with our customers. If you would like to explore how our memory solutions can support your space applications, feel free to contact your Teledyne representative – we’ll be happy to provide the details.