Siemens’ Embeddable BCI-ROM technology enables accurate reduced order thermal models of IC packages to be shared for 3D CFD thermal analysis in the electronics supply chain. — (Image credit: Siemens Digital Industries Software)
Siemens Digital Industries Software announced today that it is bringing an innovative approach for sharing accurate thermal models of integrated circuit (IC) packages to the electronics supply chain. The main advantages are protecting intellectual property, enhancing supply chain collaboration and accuracy of models for steady state and transient thermal analysis to enhance design studies.
Introduced in the latest updates to Simcenter™ Flotherm™ software for electronics cooling simulation from the Siemens Xcelerator portfolio of industry software, the breakthrough Embeddable Boundary Condition Independent Reduced Order Model (BCI-ROM) technology allows a semiconductor company to generate an accurate model that can be shared with their clients for use in down-stream high-fidelity 3D thermal analysis without exposing the IC’s internal physical structure.
An Embeddable BCI-ROM reduced order IC package thermal model used in a 3D CFD PCB thermal analysis study with component temperature results shown (Simcenter Flotherm software) — (Image credit: Siemens Digital Industries Software)
MediaTek Inc., a global fabless semiconductor company and market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and Internet of Things (IoT) products, has taken advantage of Simcenter Flotherm to drive efficiency in its collaboration with customers. “Embeddable BCI-ROM is a great way to share our thermal models with our customers. It has several key features: easy generation, confidentiality, low error rate, and suitability for steady-state and transient applications,” said Jimmy Lin, Technical Manager, MediaTek Inc.
Today’s electronics often have heat dissipation challenges that need to be resolved during design due to higher power density influenced by the miniaturization of semiconductor packages and electronic systems, trends for thin-form consumer products, or demanding processing requirements. As a result, the need for more detailed thermal models to help solve thermal management design tasks is growing. Increasingly, modern IC package architectures such as 2.5D, 3D IC, or chiplet-based designs have highly complex thermal management challenges that require 3D thermal simulation both during their development and during integration of IC packages into electronics products.
SimcenterFlothermProcessOverview.png The process of exporting an Embeddable BCI-ROM from a detailed IC package model and then using one in a Simcenter Flotherm 3D CFD thermal simulation. — (Image credit: Siemens Digital Industries Software)
“Given electronics supply chain pressures and the growing complexity of IC packages, barriers to collaboration and thermal analysis efficiency during design must be eliminated where possible to support competitive development,” said Jean-Claude Ercolanelli, Senior Vice President, Simulation and Test Solutions, Siemens Digital Industries Software. “Our breakthrough new technology enables accurate thermal models to be shared securely within the electronics supply chain without exposing sensitive intellectual property, allowing all parties to resolve thermal issues faster and bring advanced products to market more quickly.”
To learn more about Siemens’ Embeddable BCI-ROM technology and how it can enable more efficient and secure collaboration, visit: https://blogs.sw.siemens.com/simcenter/embeddable-bci-rom-cfd-thermal-model/
3D PCB thermal analysis surface temperature results using reduced order Embeddable BCI-ROM component models in Simcenter Flotherm CFD software -(Image credit: Siemens Digital Industries Software)
Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.
An FCBGA processor detailed model for 3D thermal modeling from which an Embeddable BCI-ROM reduced order model can be generated. — (Image credit: Siemens Digital Industries Software)
An FCGBA processor detailed model in Simcenter Flotherm software before Embeddable BCI-ROM reduced order model is generated — (Image credit: Siemens Digital Industries Software)
An FCGBA processor detailed model in Simcenter Flotherm software – defining geometry envelope side and temperature probe locations before generating an Embeddable BCI-ROM reduced order thermal model. — (Image credit: Siemens Digital Industries Software)
Options for exploring an Embeddable BCI-ROM reduced order model from a detailed FCBGA package model in Simcenter Flotherm CFD software. — (Image credit: Siemens Digital Industries Software)
Transient thermal analysis – comparing temperature results for 2 components modeled using Embeddable BCI-ROMs and as detailed models in Simcenter Flotherm electronics cooling simulations. — (Image credit: Siemens Digital Industries Software)
PCB thermal analysis surface temperature results shown from a Simcenter Flotherm simulation where an Embeddable BCI-ROM reduced order model of an FCBGA processor hase been used. — (Image credit: Siemens Digital Industries Software)