SECO highlights technologies for Edge AI and embedded computing at Embedded World North America 2025
SECO will showcase its range of embedded hardware products as well as Clea, its software framework for managing AI, IoT, and device cybersecurity, at embedded world North America this year. Visitors to booth #7011 will have the opportunity to experience live demonstrations showcasing SECO’s edge AI capabilities, which highlight the company’s partnerships with leading technology providers such as Qualcomm®, MediaTek, NXP, Intel®, and Axelera AI. Additionally, conference attendees will have the opportunity to hear SECO USA’s managing director, Dario Freddi, present a keynote on November 5 focused on the evolving landscape of edge artificial intelligence (AI) acceleration.
Product Highlights
SECO will showcase its latest solutions for embedded computing at the show, including new system-on-modules (SOMs) and the recently released Clea OS 2.0. The SOM-COMe-CT6-Snapdragon-X features the Qualcomm Snapdragon X / X Plus / X Elite line of processors, with a Qualcomm Hexagon neural processing unit (NPU) with an impressive performance of up to 45 TOPS and support for up to four independent displays. Soldered DRAM helps to ensure long-term reliability in rugged industrial environments.
The SOM-SMARC-MX95 offers an NXP i.MX 95 processor with 6 Cortex-A55 processing cores running at 2 GHz for performance and dual Cortex-M microcontroller cores for real-time control. Its integrated NPU provides 2 TOPS for power-constrained AI/machine learning applications.
The new Clea OS 2.0, part of the Clea software suite, facilitates the deployment of edge IoT devices. This industrial-grade embedded Linux operating system, built on the open-source Yocto Project, seamlessly integrates with the cloud and allows engineers to focus on accelerating product development with its easy system configuration. Clea OS, compatible with both SECO edge products and third-party hardware, enables edge device cybersecurity and simplifies compliance with the European Union Cyber Resilience Act (CRA) and the Radio Equipment Directive (RED) regulations.
Along with these highlights, visitors to SECO’s booth will be able to see its broader portfolio of edge computing products, including fully packaged industrial PCs, the Modular Vision series of HMI panel PCs, development kits, and a wide variety of single board computers and SOMs. All SECO hardware products work seamlessly with Clea, making it easy to harness operational data, remotely manage infrastructure, and facilitate value-added services and AI applications.
Demos Highlight SECO’s Partnerships and Edge AI Capabilities
SECO will showcase its edge AI capabilities through demonstrations of AI-powered image generation, gesture recognition, and real-time computer vision applications. These include a real-time people counter powered by an NXP i.MX 95 processor and Clea; an interactive computer vision system running on a Titan 300 TGL-UP3 industrial PC with Axelera’s M.2 AI acceleration; and a model tumour identification system that runs entirely at the edge on a Palladio 500 RPL industrial PC to assist medical professionals while avoiding network transmission of large amounts of data for cloud-based analysis.
The company will also demonstrate its AI-powered HMI solutions designed for industrial automation, medical facilities, and smart buildings. These systems integrate the latest processors from SECO’s technology partners and demonstrate the power of embedded vision and voice recognition combined with remote management and insights through Clea.
Complementing these demonstrations, the booth will also feature a generative AI application running on the SOM-COMe-BT6-MTL. It features a high-performance COM Express module built on the latest Intel® Core™ processors, with an integrated NPU that delivers up to 34 TOPS of AI computing power. It leverages an intuitive graphical user interface (GUI), enabling users to transform basic text inputs into AI-generated images, and provides exceptional compute efficiency, low latency, and scalability across various industrial and AI-driven workloads.
Conference Keynote: “Beyond GPUs: The Evolution of Edge AI Acceleration”
Dario Freddi, SECO USA’s Managing Director, will deliver a keynote examining the evolving landscape of edge AI acceleration on Wednesday, November 5 at 2:05 PM PST. The presentation will highlight emerging trends in edge AI hardware and discuss important considerations when thinking about a new project.
SECO will be in booth #7011 at embedded world North America in Anaheim, CA from November 4-6, 2025. This event offers an invaluable opportunity for visitors to explore SECO’s solutions for the North American market, supported by the company’s U.S.-based engineering and operations. To schedule a meeting or learn more about SECO, visit seco.com.