breaking News

Murata Expands Combined Gyro and Accelerometer 6DoF Sensor...

Pulsiv to revolutionise the USB-C charging market by...

Industry’s Smallest Two Pole Reed Relay Maximises PCB...

Siemens unveils next generation AI-enhanced Electronic Systems Design...

Vector and Hubject Collaborate to Advance Plug &...

The next evolution in digital engineering with Siemens...

Vishay Intertechnology Introduces Compact, Sealed SMD Trimmers for...

Introducing a Wide Portfolio of IGBT 7 Power...

Nordic Semiconductor launches nRF54L15, nRF54L10, and nRF54L05 next-generation...

Renesas Introduces New AnalogPAK Programmable Mixed-Signal ICs, Including...

Industries
Products
Technologies
Embedded Systems
Applications

ENNOVI

Power supplies
ENNOVI Optimizes EV Battery Module Cell Contacting System Design with Advanced Capabilities

by gabi 8 May 2024

8 May 2024

ENNOVI a mobility electrification solutions partner, introduces an innovative cell contacting system (CCS) lamination approach. …

0 Facebook Twitter Linkedin Email

Load More Posts

Producers

Adapdix Corporation

Advanced Energy

Advanced Photonix

Advanced Rework

AETA Audio Systems

AIRMAR Technology

Allegro MicroSystems

Alliance Memory

Andes Technology

Anritsu Corporation

Antenna Company

Apex Microtechnology

ArkX Labratories

Asahi Kasei Microdevices

Atmosic Technologies

AVX Corporation

BCN3D Technologies

Beck Automation

Bicker Elektronik

Bosch Sensortec

Boundary Devices

Cambridge GaN Devices

Camille Bauer Metrawatt

Cinch Connectivity Solutions

Cypress Semiconductor

DataCAD Software & Service

demmel products

Deutschmann Automation

Dialog Semiconductor

Diamond Systems

Digi International

DISPLAY VISIONS

DSM Engineering Materials

eCOUNT embedded

Elsner Elektronik

EM Microelectronic

Empower Semiconductor

Ericsson Power Modules

Espressif Systems

eSync™ Alliance

EVERLIGHT Electronics

Ezurio (Laird Connectivity)

Feinhütte Halsbrücke

FORTEC Integrated / Distec

General Mechatronics

Giga Computing Technology

Halo Microelectronics

Heinrichs Messtechnik

HighTec EDV Systeme

HIROSE Electric

ICP Deutschland

Imagination Technologies

Indium Corporation

Intel Corporation

iTAC Software AG

Ixthus Instrumentation

JVD Semiconductors

Kingston Technology

LASER COMPONENTS

Lattice Semiconductor

Leman Micro Devices

Leutz Lötsysteme

Ligado Networks

LightWare LiDAR

Linear Technology

MacDermid Alpha

Marktech Optoelectronics

Maxim Integrated

Microchip Technology

MicroSys Electronics

Microtherm Sentronic

Mitsubishi Electric

Navitas Semiconductor

Nordic Semiconductor

NOVOSENSE Microelectronics

Owl Autonomous Imaging

Parker Chomerics

Pervasive Displays

Phoenix Contact

Pickering Interfaces

Pico Technology

Plessey Semiconductor

PLS Programmierbare Logik & Systeme

Point One Navigation

Posifa Technologies

Powell Electronics

Power Integrations

Programming Research

QuickLogic Corporation

Real-Time Systems (RTS)

Rehm Thermal Systems

Rogers Corporation

Rohde & Schwarz

ROHM Semiconductor

Same Sky (formerly CUI Devices)

Schreiner ProTech

Sensata Technologies

Sensor Instruments

Silanna Semiconductor

Silex Technology

Silicon Storage Technology

SINN Power GmbH

Skyworks Solutions

Smiths Interconnect

SolderKing Assembly Materials

SPARK Microsystems

STMicroelectronics

Superior Sensor Technology

TASKING Germany GmbH

TE Connectivity

Telink Semiconductor

Texas Instruments

THine Electronics

Torex Semiconductor

Trackwise Designs

Trelleborg Sealing Solutions

Trenz Electronic

Triad Micro Devices

VAC (VACUUMSCHMELZE)

Vicor Corporation

Vishay Intertechnology

voice INTER connect

WeEn Semiconductors

Würth Elektronik

Yazaki Corporation

Twitter
Email

Contact
Advertising
Newsletter
Privacy Policy (GDPR) & Cookies

© EURO STANDARD PRESS 2000

Industries
Products
Technologies
Embedded Systems
Applications

Shopping Cart

Close

No products in the cart.

Close