Parker Chomerics Updates Thermal Interface Materials Catalogue with Solutions for Electronics Cooling
The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, has released an updated version of its catalogue for thermal interface materials (TIMs). Providing a comprehensive overview of Parker’s solutions for electronics cooling applications, the latest catalogue includes all recently released TIMs, as well as a new dispensing guide to help customers ensure a correct and consistent application.
Many new-generation electronic products offer higher power in a smaller package, intensifying thermal management challenges for OEM and CEM electronics companies in the telecommunications, IT, consumer, power conversion, medical device, defence and transportation markets. To help engineers overcome these issues, Parker Chomerics showcases a wide range of TIMs in its updated catalogue.
THERM-A-GAP™
For example, Parker Chomerics’ gap fillers (THERM-A-GAP™ series) come in two different types: gels and pads. Gels are low-closure-force, electrically isolating, fully cured materials that users dispense into place, while gap filler pads are highly conformable to accommodate an even wider gap range.
THERMFLOW®
The updated catalogue also features Parker Chomerics’ THERMFLOW® phase-change materials. OEMs and CEMs can place these thin pads between a heatsink and semiconductor where they change phase into a liquid at higher temperatures to achieve a very thin bond line.
THERMATTACH
THERMATTACH® thermal tapes have adhesive on both sides to hold a heatsink in contact with an IC component without the need for mechanical fasteners, while another focus product in the updated catalogue is the THERM-A-FORM™ range of potting and underfill materials. Users can dispense these one- or two-component silicone elastomer materials prior to subsequent curing in place, whereas thermal gap filler gels are already cured when dispensed.
Other solutions highlighted in the updated publication include:
- The CHO-THERM® series of dielectric pads. As well as offering thermal conductivity, CHO-THERM higher-closure-force pads for discrete power devices are electrically isolating.
- Parker Chomerics’ heat spreaders (T-WING® range), which utilise two different thermal transfer methodologies: conduction to remove heat from an integrated circuit and convection air flow over the product to remove that heat from the assembly. These thin heat spreaders are suitable for use in restricted spaces.
- Thermal greases (T series), silicone-based pastes with a thermally conductive filler material that draws heat away from a heat-generating component on a circuit board while filling very thin bond lines.
To complement the products, the updated catalogue offers added value to engineers with its new dispensing guide for thermally conductive gels, cure-in-place potting compounds and thermal greases. There is also a section on heat transfer fundamentals, ensuring readers fully understand this key electronics application before formulating ideas about the optimal solution.
To learn more, please visit: Parker-Chomerics-Thermal-Interface-Materials-Catalog.pdf
CHOMERICS
PARKER HANNIFIN CORPORATION