Omron showcased their latest sensing technologies within their new 3D-AOI machines. The two new product entries, the VT-S530 and VT-S730-H, provide high quality Solder Joint Inspection technology, called SJI. Besides this, Omron presented their new VT-X750, the world’s fastest automated X-Ray Inspection System (AXI) to utilise computed tomography as its core of image and inspection quality.
The new VT-S530 provides full 3D-AOI capability. The machine is high-performance AOI, with the largest first-pass yield, zero escape, and fewest false rejects. The technology available on the VT-S530 has been proven ultra-performant on the existing VT-S730 and especially on the VT-S730-H, with which it is sharing the new Image-Capture Module. The VT-S530 offers great versatility in application as it can be used on pre or post reflow inspection, single or dual lane; it is 01005 compliant and has the possibility to inspect XL boards of 510 mm x 680 mm.
The second new machine, called VT-S730-H, combines the high performance of the VT-S730 with high inspection speed for the most demanding electronic production requirements. The VT-S730-H post reflow inspection machines have been widely adopted in production lines where stringent quality control is required, including the automotive industry. The result is a real 3D-AOI inspection machine offering 3D full component and solder inspection capabilities.
The highlight at the Omron stand was the world fastest inline automated X-Ray Inspection System, the VT-X750. The VT-X750 increases the automated inspection speed based on 3D-computed tomography (3D-CT). The expanding inspection logic enables full, in-line inspection coverage by the 3D-CT method. OMRON’s unique 3D-CT reconstruction algorithms provide unprecedented solder-shape recognition and defect detection. Dense and dual-sided board design can present challenges for X-Ray inspection. However, Omron’s 3D-CT technology can overcome such design restraints. The VT-X750 also offers the possibility to inspect XL boards up to 610 mm x 515 mm for a foot print of nearly 50% less than other Large Size AXI machines with only 2.99 m2.
“With the VT-X750, we’re talking about a target group that has the greatest throughput in the least time. The VT-X750’s cycle times are up to two times faster than with conventional AXI platforms. So the performance increase leads to a very great throughput. Added to this is the X-ray inspection of hidden solder points, which is a large added value for the global electronics manufacturer. That’s why suppliers in the consumer-goods industry, but also especially the automotive industry, were interested in the VT-X750”, says Francis Aubrat, European Automated Inspection Business Manager, looking back. Nearly all of the well-known car manufacturers from Germany and their suppliers have registered for evaluation tests at Omron in the Netherlands during the coming weeks.
Omron | http://inspection.omron.eu