Infineon Technologies AG and Mitsubishi Electric Corporation, agreed to establish a service agreement by which they will both serve the industrial motion controls and drives market worldwide as sources for the advanced IGBT module packages SmartPACKs and SmartPIMs. This revolutionary package concept, recently developed by Infineon Technologies, will be available with the latest generation of power chip technologies from the two leaders. Under this agreement, Mitsubishi Electric will market its latest generation power chips of various ratings (current range: 15A – 200A, voltage class: 600V & 1200V) in the Smart-1,-2 &-3 housings of Infineon Technologies. Infineon Technologies, the creator of the new SmartPACK/PIM module concept, will continue to manufacture and supply the same range of fully compatible products using its own chip technologies and module manufacturing.
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