Anglia is the recent recipient of Deep Sea Electronics’ Supplier Excellence in Sustainability award, which …
Manufacturing and Materials
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Soldering pastes & materials
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, …
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Manufacturing and Materials
Parker Chomerics Develops New Gap Filler as Alternative to Hard-Curing Dispensables for Electronics Cooling
The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, …
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The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, …
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In the dynamic world of optoelectronics, where light and electronics come together, connection technology plays …
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Altus Group, a leading distributor of capital equipment in the UK and Ireland, has seen …
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Manufacturing and Materials
Murata Introduces Cutting-edge Stretchable Printed Circuit for More Flexible, Customizable, and Comfortable Medical Wearables
Murata Manufacturing Co., Ltd reveals an innovative new Stretchable Printed Circuit (SPC) technology marking a …
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Manufacturing and Materials
Parker Chomerics Unveils Latest Thermal Interface Materials and New Rapid Sampling and Prototyping Facility at Electronica 2024
The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, …
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Manufacturing and Materials
Infineon unveils the world’s thinnest silicon power wafer, pushing technical boundaries and improving energy efficiency
After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest 200-millimeter silicon …
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Companies
Infineon launches SECORA™ Pay Green – the world’s first contactless payment card technology allowing for up to 100% reduction in plastic waste
Infineon Technologies AG is paving the way to a significant reduction of plastic waste and …
