Technological and societal changes are forcing industrial companies around the world to make changes – …
Manufacturing and Materials
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Manufacturing and Materials
Tresky offers a wide range of application options for ultrasonic DIE bonding
by gabiUltrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor …
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Manufacturing and Materials
The first billion in sight: celebrating the success of Infineon’s 28 nm security ICs and smart card solutions at TRUSTECH 2024
by gabiHigher efficiency and lower environmental footprint resulting in more powerful, sustainable applications: products manufactured in …
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Embedded software
Siemens’ Solido SPICE now certified for multiple leading-edge Samsung Foundry processes
by gabiSiemens Digital Industries Software announced today that its continued collaboration with longtime customer Samsung Foundry …
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Würth Elektronik has expanded its WE-BAL series of baluns. The components for coupling symmetrical and …
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Cables/Connecting
Bespoke fibre optic datalink design & manufacturing service from OMC meets demanding requirements of IIoT applications
by gabiOMC, the pioneer in optoelectronics design & manufacture, now offers a bespoke fibre optic datalink …
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Artificial intelligence
Professors in AI from leading universities exchange ideas with Ziehl-Abegg
by gabiZiehl-Abegg received a delegation of leading professors in AI from all over the world and …
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Anglia is the recent recipient of Deep Sea Electronics’ Supplier Excellence in Sustainability award, which …