breaking News

Nordic Semiconductor continues nRF54L Series expansion with new...

Eggtronic Introduces High-Efficiency 140W USB-C Power Delivery Reference...

Vector and Infineon Technologies Introduce Chiisai: Open-Source Specification...

ROHM’s New High Anti-Surge Chip Resistors SDR01 Series...

New at Mouser: onsemi GaNEXUS GaN FETs for...

INFAC enables 48V automotive zonal architectures using Vicor...

Renesas Launches 64-bit RZ/G3L and RZ/G3SE MPUs for...

ODVA specifies ix Industrial® as a new Ethernet/IP...

Mouser and TE Connectivity Explore the Electronics Behind...

Pickering reed relays proven to have 88% lower...

Industries
Products
Technologies
Embedded Systems
Applications
Magazine Archive (PDF)

Energy Storage

Power modules
Infineon’s new XHP™ 2 CoolSiC™ high-power modules boost efficiency and power density in high-voltage energy systems

by Electronica Azi 11 May 2026

11 May 2026

Infineon Technologies expands its XHP™ 2 power module portfolio with new variants incorporating CoolSiC™ MOSFETs …

0 Facebook Twitter Linkedin Email

Load More Posts

Producers

Adapdix Corporation

Advanced Energy

Advanced Photonix

Advanced Rework

AETA Audio Systems

AIRMAR Technology

Alif Semiconductor

Allegro MicroSystems

Alliance Memory

Andes Technology

Anritsu Corporation

Antenna Company

Apex Microtechnology

Apogee Semiconductor

ArkX Labratories

Asahi Kasei Microdevices

Atmosic Technologies

AVX Corporation

BCN3D Technologies

Beck Automation

Bicker Elektronik

Bosch Quantum Sensing

Bosch Sensortec

Boundary Devices

Cambridge GaN Devices

Camille Bauer Metrawatt

Cinch Connectivity Solutions

Cypress Semiconductor

DataCAD Software & Service

Deca Technologies

demmel products

Deutschmann Automation

Dialog Semiconductor

Diamond Systems

Digi International

DISPLAY VISIONS

DSM Engineering Materials

eCOUNT embedded

Elsner Elektronik

EM Microelectronic

Empower Semiconductor

Ericsson Power Modules

Espressif Systems

eSync™ Alliance

EVERLIGHT Electronics

Ezurio (Laird Connectivity)

Feinhütte Halsbrücke

FORTEC Integrated

General Mechatronics

Giga Computing Technology

GlobalFoundries (GF)

Halo Microelectronics

Heinrichs Messtechnik

HighTec EDV Systeme

HIROSE Electric

IBL Technologies

ICP Deutschland

iDEAL Semiconductor

Imagination Technologies

Indium Corporation

Intel Corporation

iTAC Software AG

Ixthus Instrumentation

JVD Semiconductors

Kingston Technology

LASER COMPONENTS

Lattice Semiconductor

Leman Micro Devices

Leutz Lötsysteme

Ligado Networks

LightWare LiDAR

Linear Technology

MacDermid Alpha

Marktech Optoelectronics

Maxim Integrated

Microchip Technology

MicroSys Electronics

Microtherm Sentronic

Mitsubishi Electric

Navitas Semiconductor

Nordic Semiconductor

NOVOSENSE Microelectronics

Owl Autonomous Imaging

Parker Hannifin

Pervasive Displays

Phoenix Contact

Pickering Electronics

Pickering Interfaces

Pico Technology

Plessey Semiconductor

PLS Programmierbare Logik & Systeme

Point One Navigation

Posifa Technologies

Power Integrations

Programming Research

QuickLogic Corporation

Real-Time Systems (RTS)

Rehm Thermal Systems

Rogers Corporation

Rohde & Schwarz

ROHM Semiconductor

Schreiner ProTech

Sensata Technologies

Sensor Instruments

Silex Technology

Silicon Storage Technology

SINN Power GmbH

Skyworks Solutions

Smiths Interconnect

SolderKing Assembly Materials

SPARK Microsystems

STMicroelectronics

Superior Sensor Technology

TE Connectivity

Telink Semiconductor

Texas Instruments

THine Electronics

Torex Semiconductor

Trackwise Designs

Trelleborg Sealing Solutions

Trenz Electronic

Triad Micro Devices

VAC (VACUUMSCHMELZE)

Vicor Corporation

Vishay Intertechnology

voice INTER connect

WeEn Semiconductors

Würth Elektronik

Xsens / Movella

Yazaki Corporation

Twitter
Email

Contact
Advertising
Newsletter
Privacy Policy (GDPR) & Cookies

© EURO STANDARD PRESS 2000

Industries
Products
Technologies
Embedded Systems
Applications
Magazine Archive (PDF)