SECO has announced its comprehensive Solution for Embedded Payments, a turnkey solution designed to simplify …
Industries
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Soldering pastes & materials
New Two-Component Thermal Gap Filler and CIP Material (THERM-A-GAP™ CIP 35E) Simplify Application Process
by gabiThe Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, …
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The innovative EO-M-026 flux is a ready-to-use, highly concentrated special flux that has been developed …
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Power devices
Nexperia brings the benefits of clip-bonded FlatPower (CFP15B) packaging to bipolar junction transistors
by gabiNexperia announced the expansion of its bipolar junction transistor (BJTs) portfolio by introducing 12 new …
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Same Sky’s Relays Group announced the addition of latching power relay models to its power …
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Embedded software
HighTec’s Latest C/C++ Compiler Achieves ISO 26262 ASIL D Certification for Infineon AURIX™
by gabiHighTec EDV-Systeme GmbH announces the ISO 26262 certification for functional safety of its latest TriCore …