Toshiba Electronics Europe GmbH has commenced the mass production of the AEC-Q100 qualified TB9103FTG MOSFET …
Embedded Systems
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congatec – a leading provider of embedded and edge computing technology – premiered its heat …
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conga-TC750, a powerful and versatile computing module developed by congatec – a leading provider of …
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SoC / SiP / SoM / SBC / CoM
Silicon Labs Deploys Most Advanced SoC for Matter Standard: the MG26 family
Silicon Labs announced that its MG26 family of wireless SoCs is now generally available through …
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SoC / SiP / SoM / SBC / CoM
Silicon Labs Unveils BG29: The Future of Bluetooth® LE in Miniature Devices
Silicon Labs announced its new Series 2 BG29 family of wireless SoCs, designed to bring …
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Artificial intelligence
ADLINK Launches OSM-MTK510 – High-Performance, Ultra-Low Power, Rugged, Compact Solution
ADLINK Technology Inc., a global leader in edge computing, announces the launch of the new …
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AMI®, the global leader in Dynamic Firmware for worldwide computing, and congatec, a leading provider …
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ADLINK Technology Inc. announced that its industrial-grade edge AI computing platform, DLAP-411-Orin, is now fully …
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Embedded Computing
Advantech and Ecosystem Partners to Showcase Edge AI and Edge Computing at Hannover Messe 2025
Industrial IoT pioneer Advantech, together with its Ecosystem of technology partners, will use the Hannover …
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Artificial intelligence
Renesas Extends Mid-Class AI Processor Line-Up with RZ/V2N MPU Integrating DRP-AI Accelerator for Smart Factories and Intelligent Cities of Tomorrow
Renesas Electronics Corporation expanded its RZ/V Series of microprocessors (MPUs) with RZ/V2N that targets the …