HighTec EDV-Systeme, Elektrobit and Infineon are partnering to accelerate software innovation in the automotive industry …
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Siemens Digital Industries Software announced today that it has collaborated with United Microelectronics Corporation (UMC), …
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Companies
Nexperia and TU Hamburg Launch Endowed Chair in Power Electronics to Drive Energy-Efficient Innovation
Global semiconductor manufacturer Nexperia and the Hamburg University of Technology (TU Hamburg) have launched an …
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Companies
Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions (mSiC™ technology) for the Future of Power Management
The growth of artificial intelligence (AI) and the electrification of everything are driving an ever-increasing …
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SECO has announced its comprehensive Solution for Embedded Payments, a turnkey solution designed to simplify …
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Power devices
iDEAL’s SuperQ Technology Powers into Production, Reveals 150V and 200V MOSFETs With Industry-Leading Figures of Merit
iDEAL Semiconductor’s SuperQ technology has entered full production, with the first products being 150 V …
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Soldering pastes & materials
New Two-Component Thermal Gap Filler and CIP Material (THERM-A-GAP™ CIP 35E) Simplify Application Process
The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, …
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The innovative EO-M-026 flux is a ready-to-use, highly concentrated special flux that has been developed …
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Sensors
Single-chip solution for TPMS: The SMP290 sensor module from Bosch in Rutronik’s automotive portfolio
Rutronik is expanding its automotive portfolio with a compact sensor module from Bosch. The SMP290 …
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Power devices
Nexperia brings the benefits of clip-bonded FlatPower (CFP15B) packaging to bipolar junction transistors
Nexperia announced the expansion of its bipolar junction transistor (BJTs) portfolio by introducing 12 new …