Infineon Technologies and ROHM have signed a Memorandum of Understanding to collaborate on packages for …
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Manufacturing and Materials
Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity
by gabiAlphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology …
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Manufacturing and Materials
Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
by gabiToday at the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital …
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Test & Equipment
Emerson and Vrije Universiteit Brussel to Develop Wideband Testing for Active Electronically Scanned Arrays
by gabiEmerson announced the signing of an agreement with Vrije Universiteit Brussel (VUB) to advance wideband …
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Embedded software
Vector and Lauterbach Shorten Time to Market for Safety Critical Applications
by gabiVector, leading manufacturer of software tools and components for the development of software-based electronic systems …
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Power applications
Dukosi Achieves ASPICE Capability Level 2 for Its Next Generation Cell Monitoring System
by gabiDukosi Ltd, the technology company revolutionizing the performance, safety and sustainability of battery systems, today …
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Power applications
Infineon CoolGaN™ technology boosts power performance in network PoE applications of Universal Microelectronics
by gabiInfineon Technologies provides CoolGaN™ power transistors to Universal Microelectronics Co., Ltd. (UMEC) for the company’s …
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Sfera Labs has released the new SuperCaps UPS X2-Series Expansion Board, bringing integrated, supercapacitor-based backup …