u-blox, a global provider of leading positioning and wireless communication technologies and services, has announced …
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Passive components
High power density and active balancing: KYOCERA AVX’s SCM series of Supercapacitor modules – at Rutronik
by gabiWith the Supercapacitor modules of the SCM series from KYOCERA AVX, Rutronik offers extremely robust …
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Power devices
Silanna Semiconductor Takes ACF Integration to Next Level by Combining PWM Control, 700V GaN FET, X-Cap discharge, ACF Driver and UHV Start-up Regulator in Single Chip
by gabiSilanna Semiconductor, The Power Density Leader, has expanded its CO2 Smart Power Family™ of AC/DC …
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Embedded software
Siemens qualifies industry-leading IC design solutions for Intel Foundry processes
by gabiSiemens Digital Industries Software today announced that its industry-leading Calibre® nmPlatform tool for integrated circuit …
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Embedded software
Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel’s EMIB reference flow
by gabiSiemens Digital Industries Software today announced it has collaborated with Intel Foundry to develop a …
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Power modules
Vishay Intertechnology IGBT Power Modules in Redesigned INT-A-PAK Package Reduce Conduction and Switching Losses
by gabiVishay Intertechnology, Inc. today introduced five new half-bridge IGBT power modules in the newly redesigned …
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Trade fair feeling and exclusive insights into current product highlights: The HARTING Technology Group made …
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Passive components
Enhanced Electrolytic Polymer Hybrid performance: Panasonic Industry unveils ZV Series
by gabiPanasonic introduces the new ZV Series, an advanced Electrolytic Polymer Hybrid capacitor, setting new industry …