ITEC introduces the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than …
Applications
-
-
-
Automotive/Transportation
Farnell supercharges electric vehicle charge station with online resources
by gabiFarnell has announced the release of its latest solutions guide which focuses on electric vehicle …
-
Power modules
Infineon announces roadmap for state-of-the-art and energy-efficient power supply units in AI data centers
by gabiThe influence of artificial intelligence (AI) is driving up the energy demand of data centers …
-
-
Test & Equipment
TimeProvider® 4100 Grandmaster Version 2.4 Firmware Offers Embedded BlueSky™ Firewall Technology to Detect Security Threats
by gabiCritical infrastructure such as public utilities, transportation and mobile networks depend on time to synchronize …
-
-
Embedded software
Newest Mouser Series Navigates Zonal Architectures for Software-Defined Vehicles
by gabiAs automotive technology ratches up in electronics, designers have turned to zonal architecture — to …
-
-
Nexperia today announced that it is now offering its industry leading 1200 V silicon carbide (SiC) …