ITEC introduces the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than …
Companies
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Companies
Innovating for a sustainable future: Toshiba focuses on e-mobility, industrial, energy and infrastructure at PCIM 2024
Toshiba Electronics Europe GmbH and Toshiba Materials CO., LTD. (jointly “Toshiba”) will bring solutions that …
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Automotive/Transportation
Farnell supercharges electric vehicle charge station with online resources
Farnell has announced the release of its latest solutions guide which focuses on electric vehicle …
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As automotive technology ratches up in electronics, designers have turned to zonal architecture — to …
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Mouser Electronics Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection …
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Power devices
Navitas Drives High-power, High-reliability, Next-gen Power Semis for AI, EV, Industrial, Solar, and Energy Storage at PCIM 2024
Navitas Semiconductor, the industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide …
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The countdown is on: The SMTconnect trade fair for microelectronics will take place in Nuremberg, …
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Active components
NOVOSENSE Showcases its Latest Sensor, Signal Chain and Power Management ICs for Simplified Automotive Design and Industrial Control at PCIM Europe 2024
NOVOSENSE Microelectronics, a semiconductor company specializing in high-performance analog and mixed-signal chips, will present its …
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Murata Manufacturing Co., Ltd. is pleased to announce a significant licensing agreement with Michelin, Europe’s …
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Companies
SemiQ to Unveil High-Performance 1200V Half-Bridge Modules in S3 Package at PCIM Europe 2024
SemiQ, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, …