Bosch Sensortec launches the world’s smallest 9-axis motion sensor

Microchip launches lowest power, cost-effective PIC32 Family with core independent peripherals

Best in Class Linearity & Temperature Range Maximizes Effectiveness of Melexis Sensor in Automotive Laser Front Lights

Miniature 2 Watt DC-DC converter has medical safety standard 2 × MOOP compliance

Renesas Electronics Delivers First Release of Embedded Security Solutions that Protect IoT Endpoints: the RX231 Communications Security Evaluation Kit

Silicon Labs Multiband Wireless Gecko SoCs Break New Ground in the IoT

congatec fully supports SMARC 2.0 specification

7 JULY 2016
congatec-Christian-Eder-SMARC-_0-Specification

congatec’s Christian Eder played a major role in drafting the SMARC 2.0 specification

congatec – a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services – has announced its full support of the new SMARC 2.0 specification, which was released by the Standardization Group for Embedded Technologies e.V. (SGET) just a few days ago. This major technology adaption extends congatec’s leading and extensive Computer-on-Module portfolio to include a brand new solution which is perfectly positioned between Qseven and COM Express. First congatec SMARC 2.0 modules as well as carrier boards and starter kits including extensive software, driver and BIOS support will be available in August.
congatec’s support of the standard is no surprise for insiders, as congatec played a major role within the SGET in developing the SMARC 2.0 specification. The new specification heralds a milestone in embedded Computer-on-Module technology and is especially designed for particularly multimedia oriented and IoT-connected small systems.

Christian Eder, Marketing Director at congatec, Member of the SGET Board and editor of the SMARC 2.0 specification comments on the importance of the new specification: “Revision 2.0 has elevated SMARC onto an excellent quality level and we can unconditionally recommend it to our customers. Known issues with previous versions – like the all too random Alternate Function Block – have been removed and this eases customers’ entry into SMARC technology and secures long-term availability. SMARC 2.0 has got all the right qualifications to become an extremely successful new module standard, and win significant market share.”

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Power applications
7 JULY 2016

Texas Instruments meets need for skilled power engineers with Power Management Lab Kit series

Say “hello” to TI’s new voice remote control solutions

7 JULY 2016

CC2640-graphic-29June16Expanding its leadership in voice remote controls, Texas Instruments (TI) announced new voice remote control solutions as part of its SimpleLink™ ultra-low power platform. These were created to help developers easily add ultra-low power Bluetooth® low energy, ZigBee® RF4CE™ or multi-standard connectivity to their designs for voice remote controls, TVs, set-top boxes and more. For more information, visit www.ti.com/rc.

Developers can do more with less power by taking advantage of the ultra-low power nature of TI’s new SimpleLink ZigBee RF4CE CC2620 wireless microcontroller (MCU) as well the existing Bluetooth low energy CC2640 wireless MCU or the multi-standard CC2650 solution to create feature-rich remote controls with different technologies. Engineers can reuse their R&D investment for multiple standards and products.  Additionally, developers can differentiate products without sacrificing battery life with advanced features such as voice-activated commands and search, gesturing, pointing and more.

TI makes Bluetooth low energy and RF4CE development for remote controls easier by offering an all-in-one SimpleLink multi-standard CC2650 remote control development kit (CC2650RC) which also connects to the SimpleLink SensorTag ecosystem to expand functionality using DevPack plug-in modules. Find out more about the development kit and ecosystem, new BLE-Stack 2.2 and RemoTI™ 2.0 software, along with additional resources to get started. Find out more at www.ti.com/rc.

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Power modules
11 JUNE 2016

Intersil Unveils Industry’s Highest Performance Laser Diode Driver for Automotive Heads-Up Displays

Create 16×16 LED Displays with Flexible Reference Design

11 JUNE 2016

MAXREFDES99_LED-driver_SHobbyists and makers now have more flexibility and options when developing LED signs, using the MAXREFDES99# 16 × 16 display reference design from Maxim Integrated Products, Inc.
LEDs continue to dramatically transform signage and lighting. However, often LED displays today are 8 × 8 and cannot communicate many international alpha-numeric characters. MAXREFDES99# integrates four MAX7219 LED drivers to provide designers a 16 × 16 display with 256 LEDs, allowing them to create signs in multiple languages. The MAX7219 driver simplifies the process of controlling multiple LEDs in matrix or numeric display form. For fast prototyping, software code developed for the MAXREFDES99# reference design works with both ARM® mbed™ and Arduino® platforms. Developers are encouraged to build upon and enhance the code base for more signage possibilities.

Key Advantages

  • Flexible: Provides 16×16 dot matrix display for signs in multiple languages
  • Reliable: Integrates time-tested MAX7219 LED drivers for long-life signage
  • Easy to Use: Compatible with Arduino and ARM mbed platforms for quick prototyping
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Power modules
11 JUNE 2016

Vicor released four new DCM products in the VIA package