Services regarding electronic components
As one of the worldwide market leaders in the field of testing, programming, Long‑Term Conservation…
As one of the worldwide market leaders in the field of testing, programming, Long‑Term Conservation…
As one of the few European companies the HTV subsidiary MAF offers the Packaging or…
Void formation under components with large soldering planes and low stand-off heights, such as QFN…
X-in-Board technology enables embedding of special technologies (inlays) in standard PCBs
Omron introduced a series of new 3D Automated Inspection products to the professional public this year in Munich at the leading European trade show. The company presented the global release of their latest 3D-AXI system utilising Computed Tomography (CT), claiming to be the world’s fastest CT X-ray inspection system. Conventional AXI methods are no longer sufficient to detect hidden solder defects, for instance HiP and voids under BGA or LGA devices and Barrel Fill in THT Connectors. X-Ray Inspection Systems (AXI) enables these hidden solder points to be tested with minimal time expenditure. However, with the new VT-X750, Omron has once again raised the bar for cycle time and High Capability Solder Joint Inspection.
Although, the OSP finish possesses some very interesting properties, it is seen by many as…
SEICA AUTOMATION was founded to fulfill customer needs of handling systems for the electronic production.…
Not having to spend a lot of money upfront can help your business manage its…
Current lead-free soldering temperatures can damage temperature sensitive components. Moreover they can cause a shift…