Renesas’ Radiation Hardened ICs Take Flight on NASA’s Artemis II Crewed Lunar Mission
Renesas Electronics Corporation today announced its radiation‑hardened (rad-hard) ICs are being used in NASA’s Artemis…
Renesas Electronics Corporation today announced its radiation‑hardened (rad-hard) ICs are being used in NASA’s Artemis…
Anritsu Corporation has signed a sales agreement with Thurlby Thandar Instruments Limited (TTi), a UK…
Tria Technologies has expanded operating system support across its Qualcomm-based hardware. Yocto Linux, Windows 11…
Melexis announces the MLX80339, a code-free three-phase fan driver integrated circuit designed to bring efficient,…
Toshiba introduces the TPHR6704RL, a 40V N-channel power MOSFET fabricated using its latest-generation U-MOS11-H process.…
Würth Elektronik expands its product range and launches a comprehensive heat sink portfolio, divided into…
Mouser Electronics is an authorised global distributor of new products and solutions from NXP® Semiconductors,…
Arrow Electronics has announced the launch of a new evaluation platform, jointly designed in collaboration…
Infineon Technologies unveils a high‑current‑density quad‑phase power module with TLVR (trans‑inductor voltage regulator) inductors to…
XSENS MTi-8 Click is a new motion sensing Click board™ from MIKROE, the embedded solutions…