HIRO deploys next generation of scalable, edge micro data centres
Distributed edge infrastructure using modular power speeds processing and data transmission
Distributed edge infrastructure using modular power speeds processing and data transmission
Announced at IEDM 2021: Confirmed Reduced Power Consumption and Increased Speed in Write Operations on 16 nm FinFET Logic Process Embedded STT-MRAM Test Chip
Murata has co-developed a new generation of RFID modules with Michelin that are embedded into…
Analog Devices, Inc. (Nasdaq: ADI) today announced a breakthrough RadioVerse® System-on-Chip (SoC) series providing radio…
Point One and Quectel partnership creates highly affordable, small and easy to use high precision GNSS module integrating RTK for mass market applications
Molex, a global electronics leader and connectivity innovator, has acquired core technology and intellectual property…
The new “RDK2” development kit from Rutronik is a complete solution for firmware and hardware…
The “Electronic Components 20121/2022” brochure is available for download and can be ordered in printed…
Pre-provisioned modules enable out-of-the-box secure communication with AWS via Wi-Fi and cellular IoT
MAXM38643 and MAXM17225 feature the lowest quiescent current compared to competitive solutions; uSLIC built-in inductor technology reduces solution size by up to 37 percent