Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems
Microchip’s new low-density PolarFire®devices consume half the static power of alternatives while providing world’s smallest thermal footprint
Microchip’s new low-density PolarFire®devices consume half the static power of alternatives while providing world’s smallest thermal footprint
INTERCONTEC plug-and-play high-tech connectors are an ideal solution for connecting signal, data and/or power in specific applications, reducing downtime and increasing productivity.
ICP Deutschland offers with the MEC-LAN interface series an easy way to add LAN interfaces…
Kontron’s COMe-bTL6 (E2) Computer-on-Module offers up to 8 cores and supports four independent 4K displays or one 8K HDR display
Microchip’s BL1, BL2 and BL3 family, developed with the Clean Sky consortium, is qualified to stringent aerospace standards for AC-to-DC and DC-to-AC power conversion
At the base of Industry 4.0 is reliable communications infrastructure. This infrastructure enables decision makers…
Since 2019, COVID-19 has swept the world, initiating an intensive battle against this highly infectious…
New Offering Enables Low-Power Voice-Controlled Operation of Embedded Vision AI Systems in IoT and Edge Applications
Flagship video series showcases how edge computing helps factories deploy and run field-based machines without the need for central networking
Recently integrated into the Toshiba Teli industrial camera family, the XGS 16000 offers one of the highest resolutions available for compact 29 × 29 mm cameras