Flexibility meets increased power density and performance: Infineon enhances 1200 V EconoDUAL™ 3 portfolio with IGBT7 featuring new current ratings
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches new current ratings for its EconoDUAL™…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches new current ratings for its EconoDUAL™…
Application Board 3.0 provides a scalable, easy-to-use sensor development platform
Agreement Facilitates Adoption of Robotics in Industrial and IoT Sectors; EK-RA6M5 Evaluation Kit Now Official Supported micro-ROS Development Board
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection…
Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, announces a new eBook…
Microchip’s new low-density PolarFire®devices consume half the static power of alternatives while providing world’s smallest thermal footprint
INTERCONTEC plug-and-play high-tech connectors are an ideal solution for connecting signal, data and/or power in specific applications, reducing downtime and increasing productivity.
ICP Deutschland offers with the MEC-LAN interface series an easy way to add LAN interfaces…
Kontron’s COMe-bTL6 (E2) Computer-on-Module offers up to 8 cores and supports four independent 4K displays or one 8K HDR display
Microchip’s BL1, BL2 and BL3 family, developed with the Clean Sky consortium, is qualified to stringent aerospace standards for AC-to-DC and DC-to-AC power conversion