Optimized and cost-efficient design implementation using AT&S X-in-Board technology
X-in-Board technology enables embedding of special technologies (inlays) in standard PCBs
X-in-Board technology enables embedding of special technologies (inlays) in standard PCBs
Omron introduced a series of new 3D Automated Inspection products to the professional public this year in Munich at the leading European trade show. The company presented the global release of their latest 3D-AXI system utilising Computed Tomography (CT), claiming to be the world’s fastest CT X-ray inspection system. Conventional AXI methods are no longer sufficient to detect hidden solder defects, for instance HiP and voids under BGA or LGA devices and Barrel Fill in THT Connectors. X-Ray Inspection Systems (AXI) enables these hidden solder points to be tested with minimal time expenditure. However, with the new VT-X750, Omron has once again raised the bar for cycle time and High Capability Solder Joint Inspection.
Ultra-low power connectivity and battery-free sensing solutions enable development of novel IoT use cases
Scalable systems for the Embedded Cloud – optional TSN-control for time-sensitive networks – Fieldbus-connectivity to supplement or replace legacy fieldbus solutions
Time synchronization with guaranteed latency and QoS in the network – Device support in IIoT environments – Private labelling version for OEM projected – TSN demos at the Kontron booth
Simplify industrial gateway designs using new Ethernet MCUs with an integrated PHY leveraging 100 percent code compatibility across the SimpleLink MCU platform
KBox A-203 with modular architecture and numerous interfaces for IoT applications
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