Samtec Expands ExaMAX® High-Speed Backplane Connector System With New Direct Mate Orthogonal (DMO) Options
Orthogonal architecture offers improved SI performance and thermal efficiencies
Orthogonal architecture offers improved SI performance and thermal efficiencies
For companies looking into a new cleaning process, ZESTRON offers a unique service in the…
The cleaning experts at MicroCare Europe bvba are presenting their ever-expanding range of ‘greener’ cleaning…
EUTECT GmbH has developed and produced individual soldering solutions for years. Based on EUTECT’s module kit, all upstream and downstream processes involving the customer’s component soldering can be offered in his own plant cells. Machine concepts that set new standards in their scope and process coverage have been increasingly in demand for some time.
Cost reduction and cost-effectiveness are general objectives of entrepreneurial activity. As EMS service providers and…
Altus Group, a leading distributor of capital equipment for the electronics assembly industry in the…
Intersil, a subsidiary of Renesas Electronics Corporation, announced two new high-speed, isolated RS-485 differential bus…
Maxim Integrated Products, Inc. announced that its MAX14827A dual IO-Link® transceiver has been adopted by…
Renesas Electronics announced the latest update of its Renesas Synergy™ Platform, the first qualified, maintained…
Digi-Key, a global electronic components distributor, announced the addition of KiCad open source EDA software…