Void formation under components with large soldering planes and low stand-off heights, such as QFN…
QUECTEL’s first NB-IoT module is available at CODICO! Narrowband IoT (NB-IoT) is a new way…
Customers who opted in to be early adopters of the Cypress Semiconductor PSoC 6® BLE…
WEBS-7000 Is Compact, Fan-less and Ideal for Kiosk, Digital Signage, Factory Automation and IoT Applications
X-in-Board technology enables embedding of special technologies (inlays) in standard PCBs
Omron introduced a series of new 3D Automated Inspection products to the professional public this year in Munich at the leading European trade show. The company presented the global release of their latest 3D-AXI system utilising Computed Tomography (CT), claiming to be the world’s fastest CT X-ray inspection system. Conventional AXI methods are no longer sufficient to detect hidden solder defects, for instance HiP and voids under BGA or LGA devices and Barrel Fill in THT Connectors. X-Ray Inspection Systems (AXI) enables these hidden solder points to be tested with minimal time expenditure. However, with the new VT-X750, Omron has once again raised the bar for cycle time and High Capability Solder Joint Inspection.
Ultra-low power connectivity and battery-free sensing solutions enable development of novel IoT use cases
Scalable systems for the Embedded Cloud – optional TSN-control for time-sensitive networks – Fieldbus-connectivity to supplement or replace legacy fieldbus solutions
Time synchronization with guaranteed latency and QoS in the network – Device support in IIoT environments – Private labelling version for OEM projected – TSN demos at the Kontron booth