MacDermid Alpha Releases First Processes in New Memory Disk Product Line: Enklad Pretreatment
MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release…
MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release…
Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo, Feb.…
Microchip releases MAC-SA5X, enhancing its Miniature Atomic Clock (MAC) technology to deliver wider temperature range and rapid warm-up time
Hannes Niederhauser, CEO at Kontron and Chairman of the Management Board of the S&T Group,…
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature Affinity 2.0, their…
With the diversified tendencies of AI applications and continuously growing demands on computing power, the architecture of AI chip containing highly complex neural networks requires an enormous amount of computing resources to perform. As a result, the demands on memory from AI chips have increased significantly, and the demands for memory reliability have grown as well. Additionally, another fact shows that AI chip highly depends on memory repairing solution because of its high unit price.
Connectivity, power, sensors and security also feature in demos based on products, platforms and solutions from leading semiconductor vendors for range of embedded industrial applications
At productronica 2019, Butter and Salt GmbH and the Russian Ostec Corporate Group agreed on a close cooperation in the areas of marketing and communication. The Ostec Corporate Group is the largest Russian sales organization for products related to electronics manufacturing and intends to offer more marketing services locally. Therefore, the Ostec Marketing Agency was founded, targeting customers from all branches of the industry.