TE Connectivity further extends M12 range with right-angle connectors for PCBs and panels
TE Connectivity (TE), a world leader in connectivity and sensors, is once again expanding its…
TE Connectivity (TE), a world leader in connectivity and sensors, is once again expanding its…
MacDermid Alpha Electronics Solutions, a world leader in the production of innovative materials used in…
MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release…
Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo, Feb.…
Microchip releases MAC-SA5X, enhancing its Miniature Atomic Clock (MAC) technology to deliver wider temperature range and rapid warm-up time
Hannes Niederhauser, CEO at Kontron and Chairman of the Management Board of the S&T Group,…
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature Affinity 2.0, their…
With the diversified tendencies of AI applications and continuously growing demands on computing power, the architecture of AI chip containing highly complex neural networks requires an enormous amount of computing resources to perform. As a result, the demands on memory from AI chips have increased significantly, and the demands for memory reliability have grown as well. Additionally, another fact shows that AI chip highly depends on memory repairing solution because of its high unit price.
Connectivity, power, sensors and security also feature in demos based on products, platforms and solutions from leading semiconductor vendors for range of embedded industrial applications