Indium Corporation Launches New Water-Soluble, Halogen-Free Solder Paste
Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is…
Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is…
Includes a dedicated 3D Printing area on the Farnell element14 website and comprehensive series of webinars
Indium Corporation will observe the 15th anniversary of its “Live@APEX” program in 2019, featuring its…
Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry knowledge and expertise at…
Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Photonics West…
Handling specialist Afag is expanding its range of proven spindle booms (SA) to include the more powerful modules of the FL series. The new components are significantly stronger than the standard booms from the Afag handling construction kit while retaining the same module geometry. This is made possible by a smaller spindle pitch.
Free downloadable guide features expert advice on 3D printing, building a component inventory, workshop safety and more
Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the 48th NEPCON Japan, Jan. 16-18 in Tokyo, Japan.