Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit
New gate driver eliminates one in six modules; substantially reduces system complexity
SCALE-2 technology optimizes footprint, improves efficiency, performance and reliability of power inverters and converters to 3300 V
Powerbox, one of Europe’s largest power supply companies, and for more than four decades a…
Replacing Standard Resistor Chains, AEC-Q200 Qualified Devices Offer Operating Voltages Up to 3 kV in 2010 and 2512 Case Sizes
A Single-Chip Solution for a Wide Range of Needs That Combines Large Memory Capacity and an Ultracompact Package
Long-term collaboration, plus major engineering investment, leads to highly cost-effective, scalable, and convenient methodology for heterogeneous integration of different semiconductor process technologies.
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches new current ratings for its EconoDUAL™…
In power electronics and the semiconductor market the system approach is gaining momentum. To support…