Improved power density: alpitronic selects Infineon’s EasyPACK™ CoolSiC™ modules and EiceDRIVER™ X3 drivers for its 50 kW hypercharger
Following the successful launch of the HYC150 and HYC300 of their hypercharger product line, alpitronic…
Following the successful launch of the HYC150 and HYC300 of their hypercharger product line, alpitronic…
The new THERM-A-GAPTM PAD 30 and 60 from Parker Chomerics further optimise heat transfer applications in electronic systems
Lateral power delivery solution for AI processors wins Product of the year
Minimized R&D efforts and costs as well as robust and highly efficient operation of medium-voltage…
CUI Devices’ Thermal Management Group today announced the recent expansion of its dc fans and…
COSEL Co, Ltd (6905: Tokyo) today announced the expansion of its medical power offering with…
Providing advanced energy harvesting solutions for maintenance-free operation of IoT devices
Distributed edge infrastructure using modular power speeds processing and data transmission
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has developed a security solution for automotive…
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces…