Nexperia further expands its offering of Clip-bonded FlatPower packaged diodes with new automotive CFP2-HP devices
Driving the transition in product packaging by investing in capacity and portfolio
Driving the transition in product packaging by investing in capacity and portfolio
New UK facility being built to deliver lightweight, convenient and space-saving flexible printed circuit technology in high volume to EV makers
Next-gen semiconductor drives 135W fast charger, Lenovo and Navitas shine on Nasdaq
AE Artesyn power shelf for latest 21” open rack systems delivers efficiencies above 97% and enables the transition to 48 V rack power in data centers
The RAC20E-K/277 adds a 20 W AC/DC converter with high power density to RECOM’s E-K…
Next-gen semiconductor unlocks fastest possible charging for the new motorola edge+, powering over 50% in 15 minutes*
Compact driver board features reinforced isolation, ASIL B/C certification
Innovative QuarEgg™ ZVS AC-DC controller and next-gen GaN powertrain integrated into high-efficiency evaluation board
COSEL Co, Ltd (6905: Tokyo) announced the addition of a new series of high isolation…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a new family of battery management…