New Vishay Intertechnology ThermaWick™ SMD Thermal Jumper Chip Removes Heat From Electrically Isolated Components
Device Reduces Component Temperature by Over 25 %, Enabling Higher Power Handling Capability or Longer Useful Life
Device Reduces Component Temperature by Over 25 %, Enabling Higher Power Handling Capability or Longer Useful Life
New low ESR standardized series offers small design and high capacitance
IQD’s newest addition to its range of advanced oscillator modules is its IQCM-112 series of…
Available in 5050 Case Size, Devices Provide up to -20 dB Electric Field Reduction at 1 cm
METCOMTM for automotive offers high reliability and performance with best in class EMI shielding for low magnetic flux leakage
Würth Elektronik publishes Electronic Components 2020 catalog
Minimum 1500V stand-off; mini SIL/SIP packaging
Featuring Powdered Iron Alloy Core Technology, This Edge-Wound, Through-Hole Device Provides Low DCR to Reduce Power Losses and Increase Efficiency
At APEC 2020, Vishay Intertechnology will be highlighting its latest industry-leading power IC, passive component, diode, and MOSFET technologies for a wide range of applications.