Toposens introduces new ultrasonic 3D sensor featuring Infineon’s XENSIV™ MEMS microphone
Toposens has partnered up with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) to realize…
Toposens has partnered up with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) to realize…
Featuring Two Thermal Conductivity Dies in a Compact Surface-Mount Package, Devices Deliver Increased Long-Term Stability at a Lower Cost
Long-term collaboration, plus major engineering investment, leads to highly cost-effective, scalable, and convenient methodology for heterogeneous integration of different semiconductor process technologies.
What if your everyday eyeglasses became the next media for augmented reality applications? What if…
PVC4000EVK Eval Kit Allows Vacuum Gauge OEMs to Quickly Test Drive Digital Vacuum Sensing Technology
Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the XENSIV™…
From 1st to 5th March, Analog Devices (ADI) will participate in embedded world 2021 DIGITAL. …
Mouser Electronics, Inc. is the industry’s leading authorised New Product Introduction (NPI) distributor with the…
Global Distributor Leads in New Product Introductions