Vishay Intertechnology IHDF Edge-Wound Inductor With Low 15.4 mm Max. Profile Delivers Saturation Current to 230A
Featuring Ferrite Core Technology, This Through-Hole Device Provides Low DCR to Reduce Power Losses and Increase Efficiency
Featuring Ferrite Core Technology, This Through-Hole Device Provides Low DCR to Reduce Power Losses and Increase Efficiency
Farnell EMEA named High Service Distributor of the year 2019
RV1S92xxA and RV1S22xxA 8.2mm Creepage Photocouplers Reduce PCB Mounting Area by 35 Percent to Maximize Board Space
CUI Devices’ HYPERLINK “https://www.cuidevices.com/catalog/audio“Audio Group today announced the introduction of a new line of enclosed…
Space-Saving Devices Feature Profiles as Low as 1.0 mm for Computer and Telecom Applications
Microchip announces a new family of Serial Peripheral Interface (SPI) EERAM memory products that offers…
Enables Ultra High-Speed And High-Precision Motion Control of Time Synchronization Accuracy Less Than One-Millionth of A Second Between Applications
Developers need to consider bandwidth and latency when incorporating memory into systems designed for Artificial Intelligence and Machine Learning application.
What are solid state relays? In electrical terms, a relay is a relatively simple switching…
Solid State Disks Ltd (SSD), the advanced storage systems design, development and integration specialist, has…