SMART Modular Launches DDR4-3200 32GB Low Profile Industrial Mini-DIMMs
Ideal solution for ruggedized telecom and networking applications requiring high-density in a small form factor exposed to harsh environmental conditions.
Ideal solution for ruggedized telecom and networking applications requiring high-density in a small form factor exposed to harsh environmental conditions.
100 V and 200 V Devices are Footprint-Compatible With SOD-128 Package, Offer Larger Lead Widths Than SlimSMA
Optimised for 200nm glass fibre optic systems in transport, petrochemical, industrial and energy infrastructure applications
Proposing Miniaturization of Multilayer Ceramic Capacitors for Automobiles with Enhanced Functionality TOKYO
Superior in High-Temperature Characteristics, Contributing to Expanded Life under High-Temperature Environments
New generation 3D flash memory adds layers, boosts capacity, broader bandwidth and provides new design flexibility
R41T and R76H series offer a high-power density solution for harsh environments and electric vehicle applications
Mouser Electronics, Inc., continues to push forward with new product introduction (NPI) activity in the…
2 A and 3 A Devices Feature Reverse Voltages From 45 V to 200 V and Forward Voltage Drop Down to 0.36 V