onsemi Unveils World’s First TOLL-packaged 650 V Silicon Carbide MOSFET
New device offers 60% smaller packaging, enhanced performance and reduced losses
New device offers 60% smaller packaging, enhanced performance and reduced losses
3D TLC memory portfolio continues to expand, sneak preview of new security solution
Next-gen semiconductor leader steps up from mobile fast-chargers to high-power applications
X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, together with Attopsemi, the innovative one-time…
Residual currents can be analyzed via USB connection
New product line launched with 3D-TLC SDHC and SDXC memory cards for industrial applications
Murata announces the availability of the DFE32CAH_R0 series of metal power inductors high-temperature applications of…
The SST26LF064RT memory device is Microchip’s second SuperFlash® offering to be space-qualified.
VINATech Co. has announced that its VPC (Vina Pulse Capacitor) hybrid capacitors are being used…
Devices Offer Lower R25 Values of 1 kΩ and 1.5 kΩ, in Addition to a 5 kΩ Value for IGBT and Power MOSFET Modules in EVs and HEVs