Infineon introduces new E-version XDP™ hybrid flyback controller ICs for ultra-high power density designs
Following the market launch of the industry’s first PFC and hybrid flyback (HFB) combo IC,…
Following the market launch of the industry’s first PFC and hybrid flyback (HFB) combo IC,…
Many industrial applications today are moving towards higher power levels with minimized power losses. One…
KIOXIA Europe announced the development of its new KIOXIA LC9 Series 122.88 terabyte (TB) NVMe…
TTI IP&E – Europe will showcase new high-voltage connectors, sensors, relays, and power solutions to…
Toshiba Electronics Europe GmbH has commenced the mass production of the AEC-Q100 qualified TB9103FTG MOSFET…
Navitas Semiconductor, the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride…
Würth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its…
Silicon Labs announced its new Series 2 BG29 family of wireless SoCs, designed to bring…
AMI®, the global leader in Dynamic Firmware for worldwide computing, and congatec, a leading provider…
Infineon Technologies AG expands its XDP™ digital protection product family with the XDP711-001, a 48…