The ZXTR2105FQ, ZXTR2108FQ and ZXTR2112FQ regulator transistors announced by Diodes Incorporated are qualified to AEC-Q101 standards for…
Achieve higher power, better reliability and thermal dissipation in automotive LED lighting systems by selecting a controller and external MOSFET
‘Disruptive’ Magnetoencephalography System that also Lowers Costs and Enhances Scan Accuracy Wins Best Early Stage Innovation Award from European Commission
New Si117x Biometric Sensors Deliver High HRM Accuracy While Minimizing Power Consumption for All-Day Monitoring
New XH018 transistors improve flicker noise up to a factor of 10 in order to target noise-sensitive applications
X-in-Board technology enables embedding of special technologies (inlays) in standard PCBs
Omron introduced a series of new 3D Automated Inspection products to the professional public this year in Munich at the leading European trade show. The company presented the global release of their latest 3D-AXI system utilising Computed Tomography (CT), claiming to be the world’s fastest CT X-ray inspection system. Conventional AXI methods are no longer sufficient to detect hidden solder defects, for instance HiP and voids under BGA or LGA devices and Barrel Fill in THT Connectors. X-Ray Inspection Systems (AXI) enables these hidden solder points to be tested with minimal time expenditure. However, with the new VT-X750, Omron has once again raised the bar for cycle time and High Capability Solder Joint Inspection.
Toshiba Memory Europe GmbH has today started sampling Universal Flash Storage (UFS) devices[1] utilising Toshiba Memory…
Now available in Europe through TTI, Inc., a world leading specialist distributor of electronic components,…
Boosters allow scalable drive up to 60 A peak gate current; full protection features included