Nexperia further expands its offering of Clip-bonded FlatPower packaged diodes with new automotive CFP2-HP devices
Driving the transition in product packaging by investing in capacity and portfolio
Driving the transition in product packaging by investing in capacity and portfolio
LEM, a leader in electrical measurement solutions, announced the launch of HMSR DA, the first…
Higher frequency AC/DC controllers and drivers improve industrial design while ensuring optimal efficiency across the load range
New UK facility being built to deliver lightweight, convenient and space-saving flexible printed circuit technology in high volume to EV makers
Next-gen semiconductor drives 135W fast charger, Lenovo and Navitas shine on Nasdaq
AE Artesyn power shelf for latest 21” open rack systems delivers efficiencies above 97% and enables the transition to 48 V rack power in data centers
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.
The RAC20E-K/277 adds a 20 W AC/DC converter with high power density to RECOM’s E-K…
iSYSTEM’s winIDEA Analyzer now supports the AUTOSAR Run-Time Interface (ARTI) and the ASAM ARTI MDF4 trace format
In addition to the solar fluxes EO-S-002 with 2 % solids and a very low…