KIOXIA Strengthens Lineup of Embedded Flash Memory Products for Consumer Applications
Next-Gen e-MMC Devices Deliver Improved Write Amplification, Performance Stability
Next-Gen e-MMC Devices Deliver Improved Write Amplification, Performance Stability
New Power Product to Be Manufactured at Renesas’ Newly Established 300mm Kofu Factory
Simplified development of safety- and security-critical software applications
CUI Devices today announced the first launch from their Relays Group with the introduction of…
New devices will enhance efficiency and reduce size in industrial applications
New discrete MOSFETs combine superior RDS(on) x QGD figure of merit with proven Toshiba innovations for reliability and stability
Offering Higher Current Density Than Competing Solutions, AEC-Q200 Qualified Device Provides Ultra Low DCR of 0.24 mΩ and Inductance of 0.22 µH
SEGGER’s BigFAT specification, which enables any third party to store files larger than 4 GB on…
Product launch: M12 panel mount connectors with L-coding and dip solder contacts