Navitas Adds Top-Side Cooled QDPAK and Low-Profile TO-247-4L to its Package Line-Up in the Latest 5th Generation GeneSiC™ Technology
Navitas Semiconductor announced the launch of two new packages: top-side cooled QDPAK and a low-profile…
Navitas Semiconductor announced the launch of two new packages: top-side cooled QDPAK and a low-profile…
Advanced Energy Industries, Inc. a global leader in highly engineered, precision power conversion, measurement and…
Toshiba announces the launch of four new voltage-driven photorelays – TLP3407SRB, TLP3412SRB, TLP3412SRHB, and TLP3412SRLB…
Texas Instruments (TI) introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities,…
As cybersecurity regulations tighten worldwide, product manufacturers must embed security from the outset to meet…
As vehicle architectures evolve toward centralized and software-defined systems, automotive developers require flexible toolchains that…
iDEAL Semiconductor announces the expansion of its SuperQ™ 200V MOSFET portfolio, delivering industry-leading on-resistance across…
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog…
With the Proteus-IV and Ophelia-IV components, Würth Elektronik presents two new high-performance RF modules based on…
Synaptics® Incorporated announced the new, limited-edition Coral Dev Board powered by the Astra™ SL2610 product…