Improved power density: alpitronic selects Infineon’s EasyPACK™ CoolSiC™ modules and EiceDRIVER™ X3 drivers for its 50 kW hypercharger
Following the successful launch of the HYC150 and HYC300 of their hypercharger product line, alpitronic…
Following the successful launch of the HYC150 and HYC300 of their hypercharger product line, alpitronic…
The new THERM-A-GAPTM PAD 30 and 60 from Parker Chomerics further optimise heat transfer applications in electronic systems
Long-term stability and high performance in industrial environments: in the current generation of ATP DRAM…
Lateral power delivery solution for AI processors wins Product of the year
16-Bit RL78/F24 and RL78/F23 Deliver Enhanced Security, Connectivity, and Functional Safety Capabilities
Partnership to enable rapid development, implementation, and provisioning of unique and secure identity for IoT applications
Following Microsoft recently announcing Windows on Arm, SEGGER has released a J-Link software package specifically for this platform. It can be downloaded and used with all J-Link and J-Trace units at no cost.
Minimized R&D efforts and costs as well as robust and highly efficient operation of medium-voltage…
Rehm Thermal Systems discloses effects on climate change via the CDP (formerly Carbon Disclosure Project)
New ClockMatrix 2 Delivers Industry’s First Single Chip Network Synchronizer and Jitter Attenuator with Ultra-Low Jitter Clock Outputs While Supporting all IEEE1588 operating modes