Infineon introduces new E-version XDP™ hybrid flyback controller ICs for ultra-high power density designs
Following the market launch of the industry’s first PFC and hybrid flyback (HFB) combo IC,…
Following the market launch of the industry’s first PFC and hybrid flyback (HFB) combo IC,…
Many industrial applications today are moving towards higher power levels with minimized power losses. One…
In the ever-evolving world of embedded systems, Infineon Technologies AG continues to support developers with…
Würth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its…
Infineon Technologies AG expands its XDP™ digital protection product family with the XDP711-001, a 48…
Infineon Technologies AG has introduced its roadmap for next-level Battery Backup Unit (BBU) solutions for…
Infineon Technologies announces support for NVIDIA® TAO models on the PSOC™ Edge MCU family. The…
HighTec EDV-Systeme GmbH announces the release of its new LLVM-based, automotive-grade RISC-V compiler designed to…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), global semiconductor leader in power systems and…
Infineon Technologies is presenting one of the industry’s first Automotive RISC-V technology demonstrator at Embedded…