New Gap Filler Pad from Parker Delivers Superior Thermal Conductivity and Performance
The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies,…
The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies,…
The new THERM-A-GAPTM PAD 30 and 60 from Parker Chomerics further optimise heat transfer applications in electronic systems
Easy-access CAD models for conductive elastomer extrusion profiles help accelerate design cycles
New coatings and sealants protect electronic equipment from harmful EMI