Ultra compact global 3G/2G cellular module ideal for tracking and IoT applications
Constrains BOM cost and logistics complexity by selecting single 3G/2G module.
Constrains BOM cost and logistics complexity by selecting single 3G/2G module.
Dialog’s power management chipset enables Samsung’s Adaptive Fast Charging compact wall adapter to deliver market-leading efficiency with best in class charging time.
UNO R3 compatible board supports higher current demands as well as offering other useful additional features.
Microchip announces its MPLAB® Harmony Ecosystem Program for the developers of embedded middleware and operating…
U-400 eUSB modules offer highest data retention with latest SLC technology and data care management as boot device and for data logging.
Next-Generation Gecko MCUs Combine State-of-the-Art Hardware Cryptography with Advanced Energy Management Features.
Audi’s Third Combined Digital Instrument Cluster and Multi Media Interface to Employ Microchip’s MOST150 INICs With USB for Seamless Connection to System-on-Chip.
Mouser Electronics, Inc. is now shipping the highly anticipated Neo single-board computers from UDOO. The…
SiS to Integrate Projected-Capacitive Touch Sensors With Microchip’s Award-WinningGestIC® 3D Gesture Technology.
Safe, space-saving design with larger contact gaps and optimsed switching dynamics, continuous DC current up to 250A; meets IEC 60664.