QLC 3D-NAND: Rutronik adds Intels 660p SSD series to its portfolio
With the 660p series, Intel is launching the first SSDs with QLC 3D-NAND-architecture on the…
With the 660p series, Intel is launching the first SSDs with QLC 3D-NAND-architecture on the…
Würth Elektronik eiSos: WR-COM series with USB 3.1 type C
Flexible adaptation for use in clean rooms or the food and pharmaceutical industry depending on requirements
For Longer Service Life in Harsh Conditions, Automotive Grade Devices Withstand THB Testing of 85 °C, 85 % RH for 500 Hours at Rated Voltage
First MCUs Incorporating Third-Generation RXv3 CPU Core Deliver Dramatic Performance Boost for Enhanced System Integration and Superior Motor Fault Prediction in Motor-Control Applications with Embedded AI
Renesas Electronics Corporation expanded its Renesas Synergy™ S1 microcontroller (MCU) series with the introduction of the…
The multi-band SARA-N3 is globally configurable for operation under any NB-IoT network.
Silicon Labs’ Wireless Technology Enhances Productivity in Automotive Industry
Industrie 4.0 demo applications live at SPS IPC Drives trade show
Flexible connectors for demanding industrial environments